Creative Edge Software to showcase iC3D at AWA Heat Shrink Sleeve Label Technologies Workshops
Tuesday, July 12, 2016
AWA Alexander Watson Associates is pleased to announce the agenda for the Heat Shrink Sleeve Label Technologies Workshops, held on 19-20 July and 21-22 July in Minneapolis, Minnesota. Offered in English and, for the second workshop, additionally in simultaneous Spanish translation, the workshop is presented at two leading sleeve label industry participants’ facilities – Flint Group Narrow Web, for live demonstrations of sleeve label printing, pre-press, and digital photopolymer plates; and Accraply Inc., for presentations and live hands-on tutorials on MD shrink film and the slitting, seaming, inspection, application, and shrinking of heat shrink sleeve labels.
The workshop program also features presentations from leading industry technology experts including Accraply, Creative Edge Software, Flint Group Narrow Web, Hybrid Software, Klöckner Pentaplast Group, Xeikon ThermoflexX, and WS Packaging Group; a ‘cures and remedies’ panel discussion where workshop participants can quiz experts on quality issues, and how to avoid or remedy them; and an up-to-the-minute overview of the global sleeve label market from AWA Alexander Watson Associates.
The program also includes numerous networking breaks and a cocktail reception at the conference hotel on the first evening. All participants will take away a printed manual for a permanent reference of the workshop content and presentations, as well as a complimentary copy of an AWA-published manual featuring a basic list of test methods for heat shrink sleeve labels, and a glossary of terms.
The workshops are ideal for participants new to the technology, or those who wish to extend and update their understanding of the heat shrink sleeve label format, from label printers to end users, co-packers and applicators, and technical staff. Limited space is still available for registrations by selecting the “Conferences and Events” menu on the AWA website, www.awa-bv.com.