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Leary and Robatech: Working Together for a Stronger Bond at CCE International

Press release from the issuing company

CHICAGO, IL – W. H. Leary and Robatech AG are working together for a stronger bond, and will be presenting together at CCE International (March 10-12, Munich) the best precision cold glue and hotmelt application devices and quality assurance technologies for the paper converting industry.  Visitors at CCE can stop by Hall B6, Booth 458 to see these latest technologies on display and speak with the experts on reducing setup times and improving quality and overall efficiency on finishing lines.  In addition, Leary will be discussing how “Accurate Glue Application is Critical for Best Box Performance” in the Technical Seminars on March 12th, from 11:00am.

Visitors to Stand 458 will see Leary’s unique Monet™ operating system, which offers an immediate cost savings and is a proven way to quickly reduce setup and training times through its ease of use.  Monet™ software automatically configures valve, trigger, glue and detection locations based on the selected carton style and dimensions.  Monet™ software makes Leary’s gluing and detection systems the easiest to use and most easily understood systems on the market.

Additionally, Leary will have on display the latest in precision gluing devices including their Quantum™ Platinum high speed, cold glue valves, which eliminate problems caused by glue tailing. Their new 2-piece nozzle design goes a long way in reducing clean-up time and simplifying job changeovers.

Stop in at the Technical Seminars on March 12th, from 11:00am, to hear expert advice from Leary’s own Christopher Leary, Director of Sales, on how “Accurate Glue Application is Critical for Best Box Performance”.

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