Highcon a Gold Sponsor at DscoopX
Thursday, March 05, 2015
Press release from the issuing company
Yavne, Israel - Highcon will be appearing as a Gold sponsor of DSCOOPX, the tenth annual meeting of DSCOOP to be held in Washington, March 5-7th, 2015.
At the Highcon booth #332, visitors will be able to see both real customer jobs, digitally cut and creased on the Highcon™ Euclid, as well as some more extreme products, proving the key benefits and infinite design capabilities of this revolutionary solution.
Visitors to the show will get to see the capabilities of the Euclid as soon as they enter the show. The Onsite guide this year was printed on the HP 30000 at Nosco and finished on the Highcon Euclid system by ANRO.
Highcon will raffle off a mockup of the Washington Monument - digitally cut and creased on the Highcon Euclid. Visitors to the booth can take a selfie with the popup and leave their business card - the winner will take it home! The raffle will take place March 7th at 1:30 pm during the Highcon Partner Session. Vic Stalam, newly appointed President, Highcon Americas, will talk about The Benefits & Value of Digital Finishing from 1:00 to 1.30 pm in Maryland C room and two customers will be there to answer any questions about their experiences with the Highcon Euclid.
Highcon will also be showing other products clearly demonstrating the benefits of a complete digital workflow; boxes produced in collaboration with HP and Scodix, and greeting cards with HP. These samples with their intricate cutouts, etching, creasing and versioning illustrate the added value that digital finishing can offer print service providers, converters and their customers.
Don't miss the chance to learn more about the key benefits of the Highcon Euclid and digital finishing:
- Customer experience
- Design flexibility
- Extended product offering
- Improved production flow
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