MultiplePRINT® enables the high-resolution imaging of six different technologies with a single imaging system.

marks-3zet GmbH & Co. KG (Muelheim an der Ruhr, Germany) is a first-time exhibitor at this year’s Druck + Form trade fair in Sinsheim, Germany. The graphic trade fair, celebrating its 20^th anniversary this year, will take place from October 8^th to 11^th 2014.

With a booth of around 60 sqm, marks-3zet will present several new products and solutions in the areas of underpacking materials, prepress and waterless offset printing. 

New imaging concept

Amongst others, marks-3zet will present its new and unique plate imaging concept MultiplePRINT®. MultiplePRINT® offers users the possibility to image six different plate technologies with an investment-friendly 4-up or 8-up imaging system. 

Modular plate processor MPW

The hybrid imaging system can image, besides conventional wet-offset plates, both flexo plates, digital IR films, varnish plates, letterpress and waterless offset plates with a resolution of up to 7.620 dpi. For the plate processing stage, marks-3zet offers its new, tailor-made, modular plate processor MPW.

New underpacking materials

Further product novelties include the underpacking materials Highline®, Folia® and ParaTex®. With these new products, marks-3zet (known for its calibrated underpacking sheets) offers new, quality underpacking materials for high print precision. 

For further information on the product range of marks-3zet, please visit www.marks-3zet.de or their booth number 6400 at the Druck + Form fair, from October 8^th to 11^th in Sinsheim.