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Harper Corporation of America Showcases Package Printing Technology at Printed Electronics USA 2013

Friday, January 31, 2014

Press release from the issuing company

Charlotte, North Carolina - Global anilox roll supplier Harper Corporation of America was proud to participate in the tenth annual Printed Electronics USA 2013 conference and trade show, sponsored by IDTechEx. This three-day event featured 150 exhibiting companies and more than 180 presentations. Attendees were able to learn more about the latest technology available and how it impacts end-user requirements.

During this event, Harper joined with three leading universities to provide live demonstrations of the Flexographic and Gravure printing processes used in the package printing industry. “Teaming up with Cal-Poly, Clemson, and Western Michigan University was a great combination for the event,” explains Alex James, director of graphic solutions for Harper Corporations. “Their students demonstrated the Harper supplied QD Printing systems by printing the actual inserts of the handouts that were provided to the attendees.”

While Harper supplied four HarperScientific QD Printing systems, Cal-Poly provided a screen printer. This allowed attendees to see the full scope of the processes and get a better feel for what these technologies offer. They could ask questions and explore the capabilities of each process system.

Not only did attendees benefit, but the students did as well, helping to support the future of the printed electronics industry. “This is the best case scenario,” said Chip Tonkin, director of the Sonoco Institute at Clemson. “Being able to show the PE industry the capabilities of package printing processes and exposing our students to industry attendees – having them interact with them – was better than any classroom could create.”


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Label & Packaging Editor

Jennifer Matt

Patrick Henry, Section Editor
Pat has covered graphic communications for nearly 30 years as a reporter, an editor, and a commentator.


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