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Conformer Expansion Envelopes To Be Shown At Graph Expo In Cooperation With Pitney Bowes

Tuesday, October 05, 2004

Press release from the issuing company

GREAT NECK, N.Y., October 4, 2004 — Conformer Expansion Envelopes will demonstrate their versatility at Graph Expo as a part of the exhibit by Pitney Bowes in booth #3040. “For the past year since we discovered Conformer Expansion Envelopes, we have been featuring them on our fastest, most capable inserter systems,” said Pat Brand, vice president, global product management and marketing for Pitney Bowes. “In addition to featuring them at the recent National Postal Forum, we will be showing them at our booth in Graph Expo in Chicago. “The patented Conformer Expansion Envelopes are a great complement to our leading integrated mail and document management solutions,” Brand said. Graph Expo, running at Chicago’s McCormick Place from Oct. 10-13, is North America’s largest trade show and for prepress, printing, converting, and digital equipment. Pitney Bowes is among more than 600 exhibitors ready to present their newest products and services to an expected crowd of 40,000 industry professionals. “Graph Expo is the ideal venue for introducing print professionals to the unique properties of Conformer Expansion Envelopes,” said Marvin Makofsky, president of Conformer Expansion Products, Inc. “Pitney Bowes is our ideal partner for showing visitors to Graph Expo how Conformer Expansion Envelopes can streamline almost any inserting workflow.” Conformer Expansion Products, Inc. partners frequently with vendors of inserting and mailing equipment at trade shows. Its most recent appearance was at last month’s National Postal Forum expo in Washington, D.C., where Conformer Expansion Envelopes were presented by Pitney Bowes and by PFE International. PFE International manufactures folding, inserting, and forms handling equipment designed to automate manual mailing processes. At the National Postal Forum, it used Conformer Expansion Envelopes measuring 9 3/8" x 12" with a capacity for materials of up to 1/2" thickness in a live demonstration of one of its flat inserting machines. The patented design of Conformer Expansion Envelopes enables them to keep a flat, neat appearance when filled with contents too thick for ordinary envelopes to accommodate. Richard George, CEO of PFE International, called them “very well constructed envelopes” that are thoroughly suited to their task. “Their unique structure allows us to maximize pack thickness and minimize damage in the mail stream. They are a good fit all around,” he said. The Conformer Expansion Envelopes used by PFE were supplied by Cenveo, Inc., a licensed manufacturer of Conformer Expansion Products. According to Makofsky, the Pitney Bowes exhibit at Graph Expo will furnish another convincing example of the compatibility of Conformer Expansion Envelopes with today’s high-speed, high-capacity inserting and mailing equipment. “Everyone who visits our friends at the Pitney Bowes booth will understand why this world leader in mailing technology has made our products a key ingredient of its solutions,” he said.

 

 

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