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Madison Advisors and Highmark Health Solutions to Co-present on Transforming Enterprise Mail Operations at MAILCOM ‘18

Press release from the issuing company

Colleyville, Tex. – Madison Advisors is pleased to announce that Gary Simpson, vice president at Madison Advisors, and Jason Fonner, director of print operations at Highmark Health Solutions, will present a workshop at MAILCOM ‘18 on transforming enterprise mail operations into a customer communications Center of Excellence. MAILCOM, held April 9-11 in Philadelphia, is the premier event for mail communications management and is attended by executives and leaders in top corporations, governments, and institutions.

Simpson and Fonner’s session, “Carpe Diem! Now is the Time to Transform Your Enterprise Mail Operations into a Customer Communications Center of Excellence,” will discuss how the confluence of customer communications management (CCM) technology, document delivery systems and workflow management software are providing businesses with new tools and opportunities for digital transformation. Simpson and Fonner will also examine the process required to re-platform and transform the operations of print and mail providers into dynamic full-service CCM Centers of Excellence. The session will take place on Tuesday, April 10 at 10:00 a.m.

A 25-year veteran in the document lifecycle management marketplace, Gary Simpson provides a unique perspective in creating digital solutions for the entire document lifecycle. As vice president at Madison Advisors, Simpson creates document management programs for Fortune 100 companies, specializing in the financial services sector.

Jason Fonner leads a team at Highmark Health Solutions that is responsible for optimizing healthcare processing solutions by providing digital delivery solutions, secure printing, fulfillment and consulting. Fonner’s department specializes in electronic and printed media, including digitally producing highly complex variable statements, invoices and customer communications.

For more information about MAILCOM ‘18, visit this link.