Showcasing FC-BGA substrates, next-generation semiconductor packaging, and cutting-edge EUV photomasks at international event for electronics manufacturing 

Tokyo – TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc., will participate in SEMICON Japan 2024, which be will held from December 11 through 13 at the Tokyo Big Sight exhibition center.

SEMICON Japan is an international event for the electronics manufacturing sector, covering areas from manufacturing technology, equipment, and materials in the semiconductor industry to smart applications such as automobiles and IoT devices.

Demand for semiconductors and electronic devices is expanding due to the digital shift occurring across all industry sectors driven by society’s digital transformation and sustainability transformation. TOPPAN’s Electronics Division engages in business related to semiconductors and creates new value for its customers in the electronics sector throughout the world by supplying key devices centered on semiconductor-related applications and devising comprehensive solutions that extend beyond the provision of products.

The TOPPAN Group booth at SEMICON Japan 2024 will showcase a wide range of solutions, from products used in front-end semiconductor manufacturing processes, such as design and photomask production, to those used in back-end processes, such as Flip Chip-Ball Grid Array (FC-BGA) substrates and next-generation semiconductor packaging.

Main solutions on show

FC-BGA substrates
FC-BGA substrates are high-density semiconductor packaging substrates that enable high-speed, multifunctional LSI chips. As key semiconductor-related devices, they are used in diverse digital products, including server CPUs, network devices, consumer gaming consoles, CPUs, and GPUs. At SEMICON Japan, the TOPPAN Group booth will present some of the industry’s largest substrates, measuring 98 mm × 95 mm and 90 mm × 90 mm, respectively.

Next-generation semiconductor packaging
The industry anticipates growth in the use of chiplet structures, in which multiple semiconductor chips are mounted on FC-BGA substrates via interposers-substrates used for electrically connecting front and rear circuits with through-mold vias. TOPPAN is concentrating efforts on developing high-productivity interposers for next-generation semiconductor substrates using glass and other organic materials. The TOPPAN Group booth at SEMICON Japan will feature glass panel substrates in which through-glass vias and cavities for component mounting have been formed on glass panels, as well as next-generation technologies such as organic redistribution layer (RDL) interposers that use glass carriers.

Power semiconductors and turnkey services
Power semiconductors are garnering increasing attention in relation to efforts to achieve carbon neutrality. TOPPAN launched a contract manufacturing handling service in fiscal 2023 in collaboration with a Japanese foundry and provides turnkey services spanning from design to manufacture of power semiconductors.

EUV photomasks and nanoimprint molds
Tekscend Photomask, a TOPPAN Group company that manufactures and sells photomasks, has been pioneering research and development of extreme ultraviolet (EUV) photomasks since the early 2000s. The TOPPAN Group booth will display EUV photomasks driving semiconductor miniaturization as well as molds for nanoimprint that harness microfabrication technologies accrued in the semiconductor photomask business.
(Toppan Photomask rebranded as Tekscend Photomask on November 1, 2024: https://www.holdings.toppan.com/en/news/2024/10/newsrelease241001_1.html)

About SEMICON Japan 2024
Dates & times: December 11—13, 2024 10:00—17:00
Venue: Tokyo Big Sight, East Exhibition Halls
Organizer: SEMI Japan
Official website: https://www.semiconjapan.org/en 
TOPPAN Group booth: 2129

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