Registration is now open for the 20th edition of Label Summit Latin America, the leading two-day conference for the label and package printing industry in the region, which is taking place at Agora Bogotá Convention Center on 12-13 March in Bogotá, Colombia, for the very first time.

Label Summit Latin America 2024, which last took place in Colombia in Medellín in 2019, aims to equip delegates with in-depth label and package printing trade knowledge, market insights, trends, and the industry’s latest technologies. Speakers sharing their insights in a varied program of presentations and panel discussions will include leading converters from the region, renowned industry commentators, brand owners and designers. ?

Day one of the conference will feature topics such as demystifying label and package printing sustainability terminology, including the differences between compostability, recyclability and bio based. Further highlights include market analyses of Colombia, the wider region and globally, key technology trends, exploring innovations in packaging design, neuromarketing, and creating the perfect coffee label????.

Day two will address how label converters can diversify their businesses, as well as attracting and retaining fresh talent post-pandemic. Further highlights include panel discussions from label converters in Colombia and the wider Latin American region. They will explore topics such as regional growth opportunities, how the impact of digital technologies and automation could affect the future of label converting, and how the industry needs to future-proof itself.
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ARclad has been confirmed as the platinum sponsor, HP has been confirmed as the gold sponsor and ECO3 has been confirmed as a silver sponsor for Label Summit Latin America 2024. The event is also supported by regional media and trade bodies in the package and printing sector including ANDIGRAF, ABIEA, ANPACK, ASIMPRES, and many more. On the first evening of the conference, there is a networking party which is open to all visitors and exhibitors looking to grow connections and share ideas. Confirmed exhibitors include: Cartes, Daetwyler, Esko, Eye-C, GEW, Grafisoft, Harper, Mark Andy, Maxcess/Rotometrics, Nazdar, OMET and Yupo.

Mirco Mazzarella, Labelexpo Global Series Event Manager for Latin America commented: “We’re really excited to be back in Colombia after several years away, and to welcome visitors and exhibitors to Label Summit Latin America 2024, when the event takes place in Bogotá for the first time.”

Mazzarella continued: “The demand for labels and packaging solutions has rapidly grown in the region, with many label printers looking for opportunities to enhance their ongoing business strategies. Visitors to Label Summit Latin America 2024 can expect to see exclusive insights that are shaping the future of the label and package printing industry. The event is a perfect opportunity to network with global industry leaders, share knowledge or expand on existing skills.”

Tasha Ventimiglia, Americas Portfolio Director, Labelexpo Global Series said: “We are delighted to be running the 20th edition of Label Summit Latin America. Colombia is a leading Latin American label and package printing market, driven in part by its flourishing coffee production market and a thriving economy.

Ventimiglia continued: “This region is a key global market for the label and package printing industry and visitors to Label Summit Latin America 2024 can expect to discuss the latest innovations with global industry suppliers as well as grow professional networks. The high-level educational conference program provides valuable insight into the future of labels and package printing and how label converters’ businesses can compete on a global stage.”

The full two-day delegate pass for converters, brand owners and designers costs USD 300, with a 20% early bird discount if booked before the end of January. Two-day supplier/manufacturer passes cost USD 875. Full event passes include access to the exposition, conference sessions, lunch, networking party and refreshments.