Press release from the issuing company
Herndon, Va.— Students from Virginia Tech, Purdue University Northwest and Cal Poly Team claimed the winning title at this year’s 2021 Amazing Packaging Race, sponsored by Emerson, on the PACK EXPO Las Vegas and Healthcare Packaging EXPO show floor. Coordinated by show producer PMMI, The Association for Packaging and Processing Technologies, and sponsored by Emerson, the race brought together students from six Education Partner schools across the country to complete a series of challenges over four expansive halls of exhibit space.
Anna Troutt (Virginia Tech), Andrew Smith (Purdue University NW) and Serena Pu (California Polytechnic State University) outsmarted the competition with their social-media savvy and show floor strategy, meeting the most exhibitors and completing the tasks faster than their opponents. Each student on the winning team took home $1,000 in prize money.
“PACK EXPO Las Vegas and Healthcare Packaging EXPO is the world’s biggest interactive packaging classroom and students thoroughly enjoy this annual event,” says Kate Fiorianti, senior manager, education, PMMI. “It’s a great way for future leaders to learn about the industry and test their wits in the field.”
Gabby Brophy (Virginia Tech), Harash Bhutada (Michigan State University) and Shayne Babich (Alexandria Technical and Community College) took second place, while Nicholas Magan (Alexandria Technical and Community College), Leslie Kim (Virginia Tech), Alexandria Stein (Clemson) and Morgan Graham (Michigan State) brought home third place.
Competing students represented 6 Education Partner schools, including:
Alexandria Technical & Community College
California Polytechnic State University
Clemson
Michigan State University
Purdue University Northwest
Virginia Tech
Participating exhibitors included:
Baumer hhs
Belden
BW Packaging Systems
B&R Automation
Dorner
Duravant
Fallas Automation
FOX IV Technologies, Inc.
Frazier & Son
Honeywell Intelligrated
IoPP
Lenze Americas
LinMot USA, Inc.
Morrison Container Handling Solutions
OMAC
SICK
Siemens Digital Industries
Starview Packaging Machinery
Syntegon Packaging Technology, LLC
Tri-Tronics Company
Weiler Labeling Systems
© 2024 WhatTheyThink. All Rights Reserved.
Discussion
Only verified members can comment.