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WestRock, DataLase, HAVI Global Solutions, Bennett Packaging to Headline 8th Annual Digital Print for Packaging US This June

Press release from the issuing company

Editor's Note:  WhatTheyThink will be attending the Digital Print for Packaging show.  Hope to see you there!

Akron, OH – Smithers Pira is pleased to announce that Digital Print for Packaging US will return this year June 6-7, 2017. The 8th annual event will be held in Atlanta, Georgia. This year’s agenda features representatives from Georgia Pacific Digital Solutions, Zumbiel Packaging, Kodak, WhatTheyThink, Smithers Pira and many more.

Recently announced presentations include:

  • Connecting the Virtual World with the Physical presented by Datalase and Havi Global Solutions
  • Folding Cartons: Digital Printing for Mass Market Products and Packaging from Kodak and Zumbiel Packaging
  • Case Study: Corrugated Applications- 2016 packagePRINTING Excellence Award for Welch's Sparkling Project from Bennett Packaging
  • Designing for Digital presented by Georgia Pacific Digital Solutions

“Digital Print for Packaging US brings together an audience that spans the entire supply chain creating brand opportunity through digital print innovation. Together industry experts and representatives discuss the latest challenges and successes in the industry,” said Ciaran Little, Director of Operations- Americas, Smithers Pira. “Discussion at the conference will focus on the current and future outlook for digital packaging printers, brand owner experiences and wish lists for digital print, new innovations in direct-to-shape, multi-press printing and more.”

Additionally, Digital Print for Packaging US will be co-located with two new conferences: 3D Printing for Industrial Applications, June 5th and Digital Textile Printing, June 8-9th.
For more information on Digital Print for Packaging US 2017, visit printfutures.com/us-event. Sponsorship and exhibition opportunities are available, if interested; contact Ciaran Little at [email protected] or +1 (330) 762-7441 ext. 1129.



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