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Adphos Invests in Printed Electronics Industry by Providing Solution to NextFlex Consortium

Press release from the issuing company

The adphos group invests in the future of the industry by providing adphosNIR® Mini-Lab system to NextFlex’s facility

BROOKFIELD, WI – The adphos Group had a great year in the Printed Electronics market and at the IDTechEx conference and show in Santa Clara, CA this past November. The adphos group highlighted its new MicroSpot 3D system, a high density light focusing system that delivers near laser like performance at a fraction of the cost, and leveraged its partnerships within the industry with live equipment in several booths at the show. Through the various partnerships and relationships within the printed electronics marketplace, adphos and NextFlex arrived at a mutual agreement for adphos to provide NextFlex an adphosNIR® Mini-Lab system for drying, curing and sintering of inks and coatings on various substrates.

Paul Semenza, NextFlex Director of Commercialization, stated that “NextFlex is excited to install the adphosNIR® Technology and Mini-Lab system as part of our flexible hybrid electronics pilot line in San Jose, and to make it available to our members to advance their flexibility, speeds and overall processes for printed electronics applications.”

John Palazzolo, Director of Marketing and Sales for Adphos North America exclaimed “The printed electronics industry is a pivotal component of adphos’ strategic plan going forward, and as such, we feel it is important to invest in the PE market and donating the use of the adphosNIR® Mini-Lab system to NextFlex is a positive step in that direction.”

NextFlex is a public-private consortium of companies, academic institutions, nonprofits and governments with a mission to advance US manufacturing of flexible hybrid electronics. To that end adphos’ patented adphosNIR® technology allows users and manufacturers to increase production speeds and broaden the range of applications they can address with their existing equipment and infrastructure.


  • Drying, curing, heating, and sintering of substrates
  • 2x to 3x production speeds
  • Enables applications on a wider range of substrates
  • Works with various ink, coating and adhesives chemistries
  • Multiple curing levels

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