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Hein Verpackungen First in Germany with Highcon Euclid

Press release from the issuing company

Yavne, Israel - Hein Verpackungen of Traunfeld, Bavaria, has seized the opportunity to lead the market with the first installation of a Highcon® Euclid III digital cutting and creasing machine in Germany. Founded over 80 years ago, the fourth generation family business has a long-standing record of leading innovation. With their background in short-runs and displays, they see their responsiveness as being the key to their success.
The company visited the Highcon booth at drupa 2016 and immediately identified with the theme of “Unleashing the Power of Paper”.
Stephan Hein, Hein CEO said:  “We were completely fascinated by the samples produced on the Highcon products. The “wow effect” of the applications they demonstrated, especially on unprinted board, opened our eyes to the huge potential of this technology. The Euclid III will allow us to offer existing and new customers a wider range of new applications, help promote small agencies and extend the variety of products that we provide for major brands. The response we have received from our existing customer and supplier base has been highly positive. We plan to show off the capabilities at the Paperworld show in Frankfurt at the end of January 2017“.
Jens-Henrik Osmundsen, Highcon VP Global Sales: “The German market is an important one to us, representing tradition and quality and we immediately recognized the entrepreneurial spirit of Hein Verpackungen and believe that their creative approach, forward thinking, and understanding of the market trends of customization and differentiation will enable them to be highly successful with their plans to produce innovative short-run products.”
The Highcon Euclid III digital cutting and creasing machine is the third generation of Highcon machines, already installed in over 30 sites around the globe.  Highcon technology addresses today's operational challenges and answers tomorrow's growth needs by opening the door to countless new opportunities in high value applications and markets; from packaging and commercial print applications to Web-to-Pack and even 3D modeling. 

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