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Multi-Color Corporation Receives Prestigious DuPont Award

Press release from the issuing company

CINCINNATI, Sept. 3 -- Multi-Color Corporation was the recent recipient of two prestigious packaging awards at the 17th Annual DuPont Awards for Innovation in Packaging. During ceremonies held August 6, 2004 at the Kimmel Center for the Arts in Philadelphia, Multi- Color was presented with both a Gold and Diamond Award for its participation in developing Procter & Gamble's revolutionary Folgers AromaSeal(TM) Canister. The competition honors innovation in food processing and packaging from all across the supply chain - from technology and processes to equipment and converters to the end-use packagers. Chosen out of 104 entries from 36 countries, twenty-two packaging innovations received awards. The competition's most significant new developments receive the prestigious Diamond Award. The Folgers AromaSeal(TM) Canister was one of only three packages to receive this honor. Adorning this award winning package are heat transfer labels from Multi- Color Corporation. Rotogravure printed at Multi-Color's Framingham, MA facility, this label began its nationwide debut on containers in September 2003. Just under two years in development, this project has become the largest single piece of heat transfer business in the past decade. The labels are applied in one pass onto three separate panels with specially developed Therimage(TM) decorating equipment, to create the clean "no-label" look. Because heat transfer labels (HTL) are designed to react to increased temperatures, the label allows for warm containers to be decorated in-line with the molder. Once applied, these labels are permanently adhered to the container. By challenging the restrictions of traditional labeling, Multi-Color and Procter and Gamble partnered together to introduce a revolutionary new product to the market. The result, Folger's AromaSeal(TM) Canister, replaced a 150-year tradition of metal coffee cans. It is a remarkable package, with truly award winning credentials. The package will be on display at the PackExpo Exhibition in Chicago, November 7-11, 2004.