Showcasing semiconductor photomasks, advanced semiconductor packaging utilizing large glass panels, and FC-BGA substrates supporting high-performance semiconductors 

Tokyo – TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc., and Tekscend Photomask Corp. (Tekscend Photomask) will join forces at SEMICON Japan 2025, which will be held from December 17 through 19 at the Tokyo Big Sight exhibition center.

SEMICON Japan is an international event focused on the electronics manufacturing sector. It covers semiconductor industry manufacturing technologies, equipment, and materials, as well as smart applications such as automobiles and IoT devices.

Positioning the semiconductor-related business as an area for proactive expansion, TOPPAN is working to expand production capacity for Flip Chip-Ball Grid Array (FC-BGA) substrates and develop advanced semiconductor packaging technologies. Anticipating an increase in demand related to AI and data centers, TOPPAN’s electronics business is targeting sustainable growth centered on semiconductor packaging.

Tekscend Photomask, a leader in the merchant market for semiconductor photomasks, is strengthening its development and production capabilities for technologies at advanced nodes. The company is expanding its global supply system while enhancing support for extreme ultra-violet (EUV) and other next-generation processes.

Main Solutions on Show
1) TOPPAN
FC-BGA substrates

FC-BGA substrates are high-density semiconductor packaging substrates that support high-speed, multi-functional LSI chips. The TOPPAN booth will display one of the industry’s largest substrates (120 mm by 150 mm) as well as FC-BGA substrates for co-packaged optics (CPO), which make optical data transmission possible.

Advanced semiconductor packaging

With semiconductor packaging increasing in size and chiplet structures being adopted, the industry is looking to advanced packaging components that use glass or other organic materials.

The TOPPAN Group booth at this year’s SEMICON Japan will showcase for the first time glass core FC-BGAs, which feature interconnects fabricated with a glass panel substrate as the core material. The booth will also feature organic redistribution layer (RDL) interposers that use glass carriers as well as glass panel substrates combining through-glass vias and cavities with different depths on the same glass.

LSI design/turnkey services
As a provider of LSI development and design services for approximately 50 years, TOPPAN will present LSI design and turnkey services, ranging from leading-edge to mature processes, supporting a wide range of interfaces to meet customer requirements.

2) Tekscend Photomask
EUV photomasks

Photomasks are master circuit templates used in semiconductor fabrication. They are created by writing circuit patterns onto high-precision quartz plates. Leveraging cutting-edge technical capabilities, Tekscend Photomask has developed EUV blanks and photomasks used for semiconductor devices at the 7-nanometer node and below. At this year’s SEMICON Japan, Tekscend Photomask will display EUV photomasks using next-generation materials for 1.X-nanometer nodes.

Nanoimprint molds
Silicon nanoimprint molds

Round silicon nanoimprint molds with a diameter of 200 millimeters. Ultra-microfabrication employing electron beam lithography enables the formation of high-precision nanostructures, including complex 3D structures. The UV nanoimprint method facilitates pattern transfer with high reproducibility at ambient temperatures, simplifying manufacturing processes and reducing energy consumption. These molds have a wide range of applications—including AR/MR optical elements, metasurfaces, diffractive optical elements (DOEs), biochips, and distributed feedback (DFB) lasers—and pattern shape can be customized flexibly.

Quartz nanoimprint molds

These are high-quality molds where leading-edge electron beam writers are used to form ultra-high-definition nanoscale patterns on semiconductor photomask materials. Multibeam writers facilitate high-speed, high-precision writing of complex geometries, and dedicated 3D etching equipment supports a wide range of shapes. These molds are ideal for advanced devices such as high-aspect-ratio structures and metalenses.

Nanoimprint prototype development support

Tekscend Photomask has installed a HERCULES®NIL 200, a fully integrated nanoimprint lithography system from EV Group. Supporting substrate diameters from 100 to 200 millimeters, the system enables Tekscend Photomask to provide an end-to-end service in Japan from mold design through test production and short-run mass production. It can also be used in sample production for confirmation of actual shape and performance. The process is simpler than conventional photolithography and costs can be reduced. It also helps to facilitate commercialization by supporting mass production of next-generation optical devices such as light guide panels and metasurfaces.

About SEMICON Japan 2025
Dates: December 17 to 19, 2025 10:00—17:00
Venue: Tokyo Big Sight
Organizer: SEMI
Official website: https://www.semiconjapan.org/en 
TOPPAN Group booth: E6144 (East Hall 6)

https://www.holdings.toppan.com/en/ 
https://www.linkedin.com/company/toppan/ 

For more information, visit https://www.photomask.com/en.