Press release from the issuing company
Mex, Switzerland—BOBST will attend the Odyssey Expo 2023, taking place May 10-12 in Milwaukee, USA, focusing on its innovations in high-performance tooling, including TooLink and its commitment to elite Certified die-makers.
The Odyssey Expo is the only event in 2023 targeted specifically to die-cutting, die-making, foil stamping, embossing and bindery.
“At BOBST we recognize the vital importance of tooling, the need for optimal cutting, stripping and blanking tools to ensure process optimization,” said John Dickison, Area Service Manager Tooling. “We very much appreciate the skill and craft of die-making and have created an industry-leading range of tooling solutions and expertise that enables die-makers to respond to exactly what their customers need.”
One of the main solutions on show will be TooLink, which brings converting into the digital world. It is a platform that connects machines and tooling, bringing together the entire converting process to transform production flexibility, job turnaround times, and overall productivity. TooLink offers a suite of IoT applications designed to give a complete picture of dies, recipes and job histories, empowering better decision-making, and delivering increased control, automation, and efficiency.
BOBST will also be talking about its renowned Certification Program, which supports an elite group of die-makers to deliver the best possible tooling to BOBST machines.BOBST Certified die-makers preserve and uphold the Overall Equipment Effectiveness (OEE) requirements of customers, by delivering precision, accuracy and top-of-the-line tooling excellence. BOBST currently has a selected list of 15 Certified die-makers globally.
“High performance tooling can bring such great benefits with relatively modest investments,” said Dickison. “As with everything at BOBST, quality is key. With the implementation of tooling manufactured by a Certified die-maker, productivity, quality and set-up time can all be optimized. We look forward to showing attendees at the Odyssey Expo how we can achieve this for their workflows.”
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