Smart Factories, Technology Lounges and Customer Reference Sites are set as the preferred engagement model with clients. A new strategy to support the BOBST vision to shape the future of the packaging world, which reflects BOBST values and responsibilities.
Mex, Switzerland – The number of industry events and tradeshows has increased significantly over the last decade and at the same time, the communication technologies offer new ways to share content. To engage with our customers more effectively, BOBST will evolve its current Competence Centers to the next level, providing all customers and prospects with new ways to access product and solution demonstrations. Over the last few years, the Competence Centers have been growing and the investments made are quite significant. They have become the preferred place to showcase live customer experiences and to validate investments.
This transformation will lead into new Smart Factories, which will encompass Technology Lounges, Partnerships and Application Experts to demonstrate complete end-to-end solutions where customers will be able to touch and see everything required to produce a label, pouch or box. From substrates processing, to job preparation, color management, printing, tool preparation and converting, all with the option to test specific jobs from converters.
We have started to virtualize the customer experience with live streaming demonstrations – across all equipment in our existing Competence Centers, providing an engaging customer experience with less traveling constraints. There will be further information on these new ways of engagement soon.
BOBST is reducing its presence at industry tradeshows and thereby dramatically reducing the environmental impact. As a result, we have decided not to attend drupa and other industry tradeshows in 2021, while maintaining a limited participation in Asia.
BOBST is at the start of a new journey, which will enable us to engage with our customers in a quicker, more effective and more personalized manner, reducing the environmental burden and shaping the future of the packaging world.