Smart Packaging technology are gradually replacing traditional packaging for the improved quality and shelf life that they offer. Smart packaging offers myriad functionalities in addition to the basic function of protection, communication and containment. The smart packaging interacts internally and externally with the environment and performs a plethora of functions such as monitoring of freshness, safety, information, quality and others. There are different types of packaging such as electronic, electrical, mechanical/chemical. It is expected that the electronic smart packaging will grow faster in the coming years.
According to Infoholic Research, it is estimated that the Worldwide Electronic Smart Packaging Market will witness a CAGR of 45.5% during the forecast period 2016–2022. The hyper growth in future will be triggered due to the use of printed electronics in packaging. Printed electronics is a key enabling factor for smart packaging innovations. There exists an enhanced demand for intelligent food packaging solutions.
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The electronic smart packaging can be used to send sound, light, display or electronic signals. This makes the packaging highly attractive, secure and interactive. The new printed electronic technology in packaging will support various packaging substrates to bring down the cost of packaging as well. It is expected that electronic smart packaging will drive the market in the coming years for its lower price, flexibility and additional functionality of the packaging. The electronic smart packaging market is segmented by technologies, applications, end-users and geographic regions. The electronic smart packaging market is expected to grow due to the increasing demand for consumer goods, increase in the population, lack of organic products, and reduction of life span of food products and low-cost electronics.
North America, Europe, Asia-Pacific and MEA are the key regions covered in the report.
Segmentation by End-Users
The Worldwide Electronic Smart Packaging Market is segmented by the following end-user types – Food, Beverage, Healthcare, Personal Care, Logistics/Transportation, Industry Machineries and Others.
Segmentation by Applications
The Worldwide Electronic Smart Packaging Market is segmented by the following application types – Printed Light, Printed Touch, Printed Antennas, Printed RFID, Printed Sensors and Others.
The study gives an opportunity to the industry players to improve their current business approach by providing them strategic intelligence about the competition in the market. Current and predicted business strategies for the leading companies of the market
The Worldwide Electronic Smart Packaging Market report includes a detailed competitive benchmarking of the leading vendors based on some key metrics such as business units, geographic revenue, recent developments, business focus, business strategy and SWOT analysis.
Some of the players included in the report are Thin Film Electronics, Smartrac NV, Bemis Company, Sealed Air and PakSense.
The report will be useful to the key stakeholders of the electronic smart packaging market such as packaging industries, technology providers, end-users and electronic providers in the following ways:
Competitive analysis (i.e. current and future key business strategies of the competitors and their regional growth)
Drivers and growth opportunities in different regions
The report includes Information related to latest industry and market trends, key stakeholders, industry pest analysis and competitive landscape and details of ongoing and upcoming electronic smart packaging projects. The report provides a comprehensive analysis of the electronic smart packaging market aiming to bring improved supply chain process, better brand image, customer loyalty and improved quality of food. The report provides a detailed analysis of the electronic smart packaging in terms of technologies, applications, end-users and regions. It also provides a detailed analysis of the printed electronics in the smart packaging. In addition, the report also gives details about the printed electronics investments in smart packaging and ongoing and upcoming electronic smart packaging projects.
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