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Co-Located Events Add Value at Odyssey Expo 2019

Friday, April 19, 2019

Press release from the issuing company

Crystal Lake, Ill. – Odyssey Expo 2019 will be held May 1-3 at the Cobb Galleria Centre in Atlanta, Georgia, USA. On-press classroom demonstrations, live equipment running on the event floor and experts from all sectors of the diemaking, diecutting and print finishing industries are just a few of the reasons for attendees to register now for Odyssey Expo 2019.

Adding even more value, several co-located events have been announced.

PIAG Educational Track: In partnership with Printing & Imaging Association of Georgia (PIAG), a special session track will be presented on Wednesday, May 1. These three programs will include two classroom sessions (Designing for Foil & Specialty Effects; Finishing/Foil In-House or Finishing/Decorating Partner) and an on-press Techshop on the MGI JETvarnish 3DS that will showcase digital spot varnish and digital foil capabilities. Sessions within the PIAG track are available to all Odyssey Expo attendees, with registration on the Odyssey website (www.OdysseyExpo.org). PIAG also will host a reception after the programming concludes.

Binding Summit 2019: This one-day event, to be held on Tuesday, April 30, is hosted by the FSEA Binding & Loose Leaf Division. Attendees can network with fellow bindery owners and managers throughout a day of programming related to recruiting, marketing and industry challenges. A free three-day pass to the Odyssey Expo Technology Hall is included with registration at www.OdysseyExpo.org/Binding/

NextGen/Young Alliance Reception: IADD NextGen and the FSEA Young Alliance bring together industry members under the age of 45 or with less than five years of experience to network at a complimentary reception on Wednesday, May 1, from 4:30 to 5:30 p.m. Email info@odysseyexpo.org to RSVP.

WomenConnect Networking Breakfast: Women in diecutting, diemaking and print finishing will gather to discuss issues in manufacturing, making important connections with others throughout the world. Featuring a special SHEnote presentation on “Finding Your Voice” by Deborah Corn, Print Media Centr, the complimentary breakfast will be held Thursday, May 2, from 7:30 to 8:45 a.m. Email info@odysseyexpo.org to RSVP.

Odyssey Expo 2019 is small enough to remain tightly focused on the diemaking, diecutting and print finishing industries, and large enough to ensure industry professionals can evaluate new technologies and bring back concrete solutions that will have immediate impact on productivity and efficiency. A full lineup of educational sessions, TechShop demonstrations and equipment scheduled to be on display at Odyssey Expo 2019 is available online at www.OdysseyExpo.org

For more information on Odyssey Expo 2019 – the industry's premier event sponsored by the International Association of Diecutting and Diemaking (IADD) and the Foil & Specialty Effects Association (FSEA) – visit the Odyssey website at www.OdysseyExpo.org, email info@OdysseyExpo.org or contact the IADD directly at 1-815-455-7519 or the FSEA at 1-785-271-5816.

 

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