HP Showcases Digital Packaging Innovation at PACK EXPO 2018
Thursday, October 11, 2018
Press release from the issuing company
Palo Alto, Calif. – HP Inc. will present at PACK EXPO 2018 innovations and tools in its diverse packaging portfolio enabling converters and brands to grow and differentiate in the industry with the full benefits offered by HP digital printing, including reinventing consumer engagement, speed to market, lower costs, and security solutions.
At PACK EXPO, HP is showcasing additional applications to automate production and maximize business opportunities from HP PrintOS, the unique cloud-based workflow and automation solution, including:
· PrintOS Site Flow for Labels and Packaging, an end-to-end production management solution for high volumes of orders, enables customers to profitably produce hundreds and thousands of short-run jobs per day by simplifying and automating order submission, pre-press, shop-floor management, order dispatch and shipping.
· PrintOS OEE utilizes the industry standard OEE (Overall Equipment Effectiveness) methodology to increase press productivity by up to 20% by highlighting the operational opportunities around the performance, availability and print quality of the HP Indigo press.
· PrintOS Box EPM Preflight: PDF files submitted to PrintOS Box are automatically scanned for compatibility to print with HP Indigo’s ink and cost-saving Enhanced Productivity Mode.
· PrintOS Marketplace offers a variety of cloud-based print production tools from HP and partners, integrated within the HP PrintOS platform. Printers can access this online community platform to access free software trials, share knowledge, identify opportunities for growth and differentiation and to automate production processes.
HP SPS driving innovation and opportunity for OEM systems
HP Specialty Printing Systems (SPS) will hold a number of demos for its OEM products, driving innovation for labeling and packaging applications for a wide range of vertical markets, including product identification on primary, secondary packaging, and on-demand specialty packaging.
HP SPS is showing the new 22mm wide-swath printhead for high-speed, high-resolution marking needs, including 1D and 2D bar codes, enabling brands to benefit from advanced product identification, anti-counterfeiting, and track and trace. Using HP Thermal Inkjet Technology, the new HP 22mm Printhead can be easily integrated into OEM printing systems and configured to specific applications. It will be commercially available in the first half of 2019.
HP OEM Partner, Code Tech, will be disrupting the industry with groundbreaking marking and coding product announcements and demos powered by HP TIJ Technology. It will showcase its exclusive IP65-rated printer, as well as unveiling new printers and technology to add to the cost-effective lineup of Markoprint Premium Partner offerings.
HP OEM Partner, ID Technology, will display its newly released ClearMarkTM Thermal Inkjet printer in the HP booth”. ClearMarkTM uses the latest in HP Thermal Inkjet technology and an all new large and easy to use interface.
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