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BOBST reveals game-changing innovations to be showcased at FEFCO 2017 

Thursday, October 05, 2017

Press release from the issuing company

Visitors will have the opportunity to learn all about the new technology at the BOBST stands

Mex, Switzerland - BOBST, one of the world’s leading suppliers of equipment and services to packaging and label manufacturers, today announced that it will feature innovations in post-print flexo and automatic packer technology for folder-gluers at this year’s European Federation of Corrugated Board Manufacturers (FEFCO) Technical Seminar 11-13 October 2017 in Vienna. 

THQ FlexoCloud is a major leap forward in post-print flexo, bringing unmatched quality on corrugated board at lower cost in one pass. The THQ FlexoCloud technology – first revealed at a recent private seminar at its Lyon Competence Center – is promising significant improvements over existing post-print flexo technology, with a large color range, perfect color density with solid printing and outstanding quality on a large range of liners. 

SPEEDPACK meanwhile, is a new automatic packer that will allow users to realize the full potential of their BOBST folding-gluing line. With the highest possible number of batches per hour and very short set-up times, it drastically increases productivity. This robust and ergonomic packer can process literally all types of boxes, while preserving their quality, thanks to particularly smooth movements and other patented solutions. As the most productive packer on the market, SPEEDPACK could soon become the natural extension of your corrugated folder-gluer.

Premium Gap Control ensures total quality folding to your exact specifications, on 100% of your boxes. This is an extremely easy-to-use and reliable system, bringing total control of the folding process and major resource savings, with removal of non-compliant packaging, waste and customer complaints, as well as operator time dedicated to control and compliance. Come and find out more about the first 100% Gap Control on finished boxes on the market. 

We will be demonstrating all three of these technologies at the stand, along with some other surprises. Come to the BOBST stands – 079, 080, 081 and 082 – to talk to us and find out more!

 

 

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Label & Packaging Section

Jennifer Matt

David Zwang, Editor/Analyst
David travels the globe helping companies increase their productivity, margins and market reach.

 

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