Adphos Introduces the MicroSpot 3D at IDTechEx Printed Electronics Exhibition in Santa Clara
Tuesday, November 01, 2016
Adphos has manufactured a solution for the industry which features laser-like performance and precision for a third of the price allowing users to expand their application range
BROOKFIELD, WI – The adphos Group is thrilled to showcase the newest solution for the Printed Electronics market, a high density light focusing system that delivers near laser like performance at a fraction of the price. Designed to dry, cure and “pin” material for 3D and direct to shape printing applications, the MicroSpot 3D will put radiant energy exactly where needed. The MicroSpot 3D will be demonstrated live in the adphos booth C09 at the IDTechEx conference and exhibition in Santa Clara Nov. 16th and 17th. The adphos Group encourages attendees to stop by and learn about how a potential relationship can help take their companies to the next level.
adphos is dedicated to solutions that move the industry forward which is why they offer technology that enables “light speed” improvements in throughput and versatility. The adphosNIR® technology allows users and manufacturers to do more with their current system – including high speed and cost effective drying, curing and sintering of a wide range of inks, coatings, adhesives – as well as other thermal processes.
The Printed Electronics Show
adphos will be demonstrating equipment live and unveiling the MicroSpot 3D solution to the market in booth C09 (front entrance). Attendees will not want to miss the opportunity to learn about the adphosNIR® technology and how it can elevate their printed electronics offerings. The group will also demonstrate how to take applications from ‘Lab-to-Fab’ (demo to production) across multiple platforms. The proprietary adphosNIR® technology has been the key in improving daily operational productivity, efficiency and a major component to a lower cost of operation.
- Near instant start/stop increases productivity
- Faster speeds
- Drying, curing and sintering of a wide range of applications
- Lower cost of acquisition on new systems
- Lower total cost of operations