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Label Release Liner Seminar to be Held in Chicago

Friday, July 01, 2016

Press release from the issuing company

AWA Alexander Watson Associates Label Release Liner Seminar is now an established feature of the industry calendar – and conveniently takes place just before the annual Labelexpo exhibition and conference.   This year’s location is Chicago, so Labelexpo exhibitors and visitors can gain an expert update on a key aspect of pressure-sensitive labeling on September 12th, at the Donald E Stephens Convention Center, Rosemont, just before the show opens at the same location. 

The AWA Label Release Liner Seminar program, for all associated with and involved in the pressure-sensitive label and release liner market – suppliers, producers, and users – features presentations and interactive discussions on current industry topics, issues, and opportunities, as well as up-to-the-minute market data from release liner research specialists AWA Alexander Watson Associates.   

Linerless labels

This year’s program includes a session on linerless labeling,  now an established technology, especially for food pre-packs,  featuring speakers from Catchpoint Ltd, UPM Label, Pack & Release, and Maan Group;   and an update on the latest developments in optical quality control for release liner from Jochen Koenig, MD of inspection specialists Dr Schenk.

Release liner recycling

A new and particularly relevant feature of the program is a release liner recycling session, with presentations from TLMI Environmental Committee Chair Calvin Frost, Renae Kulis, Senior Director and Global Head of Sustainability at Avery Dennison, and Robert Parker, owner of label converters Label King, who is an active and successful participant in the recycling arena.   The session will close with an interactive discussion with delegates on current status, and on evaluations of the way forward. 

The AWA Label Release Liner Seminar  2016 is now open for online registrations at www.awa-bv.com, where the full program may also be viewed.   Platinum sponsors of the event are Dow Corning and UPM, and gold sponsors Mondi and Wacker.   The event complements the annual AWA Global Release Liner Industry Conference which also alternates between Europe and USA, held this year in Vienna (AT), and which will take place next year in Chicago, March 29-31.

 

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Label & Packaging Section

Jennifer Matt

David Zwang, Editor/Analyst
David travels the globe helping companies increase their productivity, margins and market reach.

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