Sun Chemical to Showcase Packaging Solutions Designed to Enhance Productivity and Shelf Appeal at EMPAQ 2016
Wednesday, March 16, 2016
Press release from the issuing company
SAN SALVADOR, EL SALVADOR – Visitors of Sun Chemical Booth #3 at EMPAQ 2016 in the Hotel Sheraton, will be introduced to a broad portfolio of packaging solutions for all markets designed to enhance productivity and shelf appeal.
“Converters are always looking for ways to increase productivity,” said Fernando Tavara, President, Sun Chemical Latin America. “Sun Chemical has a variety of solutions that will be shown at EMPAQ 2016 which are designed to enhance productivity. From laser marking solutions designed as a late-stage differentiator and color management solutions, to inks that maximize pressroom efficiency, Sun Chemical can meet the individual productivity needs of each individual customer. We can even be a one stop shop for both inks and adhesives.”
One Stop Source for Both Inks and Lamination Adhesives
The SunLam family of lamination adhesives consists of water-based, solvent-free and solvent-based products designed to meet the needs of all major packaging applications, including lamination, aromatic retort, and film/food packages.
With local inventories available everywhere in Latin America along with strong local customer technical service, SunLam has been formulated to complement Sun Chemical’s wide range of lamination inks in the most demanding environments and applications. SunLam lamination adhesives deliver superior adhesion, a fast curing combination of adhesive and hardener to reduce the delay between lamination, slitting and shipping, improved resistance to strongly acidic foods and liquids, suitability for use with both flexographic and rotogravure print processes, and high bond strengths even after package sterilization or boiling.
Converters can also use a SunLam lamination adhesive with oxygen barrier properties to lightweight packaging by removing a film layer while still maintaining the protective functionality required to preserve the contents and avoid migration.
During the show, SunLam’s capabilities will be highlighted at a seminar “Lamination Adhesives: Trends and Innovations” delivered by Tomoo Okubo, a Functional Coatings Technology Specialist at Sun Chemical, from 10:40 to 11:20 a.m. on April 21st in the Presidente room. Okubo will discuss solvent-less and solvent-based adhesives as well as the latest trends and innovations in laminated packaging. He will also highlight the benefits of being a one-stop-shop for both inks and adhesives.
Sun Chemical to Host Workshop Introducing Color Management Tools
Lissette Recinos, a Power User at Sun Chemical’s San Salvador Color Center, will demonstrate Sun Chemical’s color management capabilities and consultative services that it can offer customers with its SunColorBox toolkit during a workshop that will be held on April 21st from 9:20 to 10:00 a.m. in the Embajador room.
During the workshop, attendees will learn how Sun Chemical’s SunColorBox toolkit offers a range of services from consulting and the visualization of a brand’s digital colors with proofs and a digital handbook with color standards, to the creation of a full digital color communication between the ink supply and customer network.
Sun Chemical to Speak about Regulatory Trends Facing Flexible Packaging Industry
Carlos Lopez, a Technical Manager at Sun Chemical Central America, will talk about the main regulatory trends for the flexible packaging of foods during a forum with converters and brand owners on April 22nd from 5:05 to 5:45 p.m. in the Presidente room.
During the show, Sun Chemical can talk with customers about products that help address the risk brand owners may face in food and pharmaceutical packaging, where compounds from materials in the packaging structure can migrate into the product or the surrounding environment. Sun Chemical offers a wide range of low migration and low odor inks that meet the strictest of regulations worldwide.
Solvent-Based Ink Systems Enhance Productivity and Meet Print Quality Requirements of High-Speed Printing
Suitable for surface print applications on a number of the commonly used flexible packaging substrates, Sun Chemical’s SunUno Solimax multi-purpose ink system will maximize press room efficiency while simplifying the overall print production process. Intended for surface printing and lamination for various end-use applications, such as lidding materials, medical laminates and food packaging for confectionery and snack food, these inks provide a single platform that can cover multiple end use applications and produce the shelf stand out and high quality packaging needed for today’s competitive industry.
SunLase™ Laser Marking Solutions Offer Late Stage Package Customization Capabilities
Visitors of the Sun Chemical booth will be introduced to SunLase™ laser marking solutions, a coating that enables brand owners to add information to both secondary and primary packaging information after the filling and closure of the pack, whether for practical supply chain purposes or as a late stage package differentiator.
The SunLase solution prints a transparent or tinted coating onto a packaging substrate during the printing process. After the packaging has been sealed, variable coding graphic information, such as barcodes, QR codes, and “Use By” dates or branding, can be created using a low power CO2 or fiber laser to change the color of the patch to black where marked, with no risks to the packaged product.
SunStrato Duraflex Inks for Flexible Film
One solution for flexible packaging that will be on display includes SunStrato Duraflex, Sun Chemical’s latest generation of lamination inks suitable for reverse printing of flexible films. These lamination inks provide optimum performance on both rotogravure and flexographic presses and offer high speed, high quality, and low solvent retention performance required for maximum press efficiency. In addition to high bond strength, SunStrato Duraflex inks provide the shelf stand out and high quality package look demanded in today’s packaging market.
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