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TAPPI Announces 2015 John O. Telesca Corrugated Engineering Scholarship Winner

Wednesday, June 03, 2015

Press release from the issuing company

Atlanta, Ga. – This year’s recipient of the John O. Telesca Corrugated Engineering Scholarship is Alex May. This scholarship is presented to a student who has demonstrated a significant interest in pursuing a career in the corrugated container, pulp and paper industry.

May currently attends North Carolina State University majoring in both Paper Science & Engineering and Chemical Engineering. He previously interned at RockTenn in Hopewell, VA, and was a fall co-op for PCA in Valdosta, GA.

May is the treasurer of the NCSU TAPPI student chapter, plays intramural soccer and participates in Reformed University Fellowship.

After graduation, May plans to join a corporate business team responsible for providing technologies to new customers, adding value to the company through team management skills for installation of new lines, mills, and business ventures before joining an executive leadership team and leading a successful company.

TAPPI is pleased to congratulate this promising student and future Young Professional.

 

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Label & Packaging Editor

Jennifer Matt

Patrick Henry, Section Editor
Pat has covered graphic communications for nearly 30 years as a reporter, an editor, and a commentator.

 

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