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Pregis implements education-related initiatives to support next-generation packaging professionals

Press release from the issuing company

Deerfield, Ill. - As part of an ongoing effort to help educate the next generation of packaging professionals, Pregis LLC, a North American leader in protective packaging solutions, has implemented several initiatives. These include student internships, mentoring, equipment/material donations and event sponsorships.

Pregis is partnering with four institutions (Cal Poly State University, Clemson University, University of Wisconsin, Stout and Michigan State University) with packaging curriculums.

“Our goal is to support the universities and connect with students to share our packaging knowledge,” said Cherie Barnier, director of human resources. “Today’s students will be tomorrow’s packaging engineers and decision makers, so it is important that we, as industry professionals, invest in their future.”

On May 7th, Pregis is once again sponsoring Cal Poly State University’s egg drop competition, which allows students to put their packaging knowledge to the test. Each student will be given an identical kit containing a variety of materials from which to construct a shipping container. The challenge is to prevent an uncooked (Grade-AA Large) chicken egg from breaking when dropped from a height of 30 feet.

The egg drop competition is part of the Poly Pack Symposium, a day-long event which gathers packaging professionals from around the nation to network and present new topics and techniques to students and industry members.

Pregis also recently sponsored Clemson’s annual Packaging Jamboree and presented the latest protective packaging trends to attendees.

Additionally, Pregis has assigned ambassadors to the four universities with whom it has partnered. The ambassadors are Pregis packaging professionals and alumni of the respective schools. The objective is to create ongoing dialog and actively contribute toward the curriculum development of each packaging program.

Pregis also expects to offer five internships this year in the following disciplines: package design, packaging systems, information technology and two junior account manager positions.

Barnier added, “We are excited about collaborating with each university to help advance their packaging program and work with their talented students. We want to encourage the flow of ideas and solutions to and from them.” 

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