DÜSSELDORF, GERMANY – During Interpack 2014, Sun Chemical and its parent company, DIC, will introduce its new SunLam lamination adhesives range. 

On display at Sun Chemical’s booth located at Stand C10/Hall 7a, the SunLam family of performance lamination adhesives. Initially developed by DIC for the demanding Asian market to offer optimal performance, even with challenging food products and processing conditions.

Colin Smith, European Product Manager, Sun Chemical comments: “Brand owners are looking for flexible packaging solutions that can replace some of the historic rigid packaging applications. While retaining or improving upon current barrier properties of the structure which has, in most cases, a direct effect on the shelf life and integrity of the product. SunLam adhesives do just that. They can have a significant effect in terms of product resistance and high temperature stability. The latest oxygen barrier adhesive technology also gives the opportunity for lightweighting, reducing cost & complexity, while maintaining overall performance.

The SunLam family of lamination adhesives consists of water based, solvent free and solvent based products designed to meet the needs of all the major flexible packaging applications globally.

For more information about Sun Chemical’s packaging solutions and services on display at Interpack 2014, please visit www.sunchemical.com/interpack or Hall 7a, Stand C10 on 8-14 May, 2014 in Düsseldorf, Germany.