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IDTechEx and Pira Intl to Host 2nd Intelligent & Smart Packaging Conference

Monday, November 24, 2003

Press release from the issuing company

November 24, 2003 -- This second Intelligent & Smart Packaging conference follows the sell-out of the first one and is a major event covering this dynamic sector of the packaging industry. Hosted jointly by IDTechEx, a leading independent expert on the development and application of smart label technologies, and, Pira International, a leading commercial consultancy business that specialises in the packaging, printing, and paper industry. Full and updated information on the programme can be found at: www.idtechex.com or contact Corinne Jennings c.jennings@idtechex.com A smart or intelligent pack is one that incorporates a disposable device that interacts with the consumer or its environment. Smart packaging will totally transform the retail environment and the products we purchase as consumers in the future. Smart Packaging is now tackling some very big issues from reducing supply chain costs by up to 90% to saving lives in hospitals. We now have in our sights the replacement of trillions of barcodes yearly with radio tagging that is much more reliable and versatile. Soon to come are new packages that self heat or self cool and that preserve food or deliver medicine only according to need. Intelligent & Smart Packaging 2004 will present a combination of the worldís leading experts who will be able to tell you where the technology is going and help you plan your business for the opportunities and challenges that lie ahead. The conference will include case study presentations of smart and intelligent packaging already being used globally. There will be a number of technical review presentations of the very latest technologies and some ìblue skyî glimpses of what the future is likely to bring. Day One (Monday 27 January) will concentrate on topics such as "Reducing Costs and Increasing Retail Sales", "Intelligent and Smart Packaging for Food and Beverages" and "Needs and Adoption Worldwide". We will hear from speakers including the US Army, Nestle, IDEO (Prada New York), Toppan, Tetrapak and Alien Technology. Day Two (Tuesday 28 January) will focus on: "Smart and Intelligent Packaging for Pharmaceutical and Medical Sectors", "New Applications for Intelligent Technologies", "Progress Towards Low Cost Printed Electronics for Packaging" and "Intelligent Technologies for Security and Anti-Counterfeiting". Speakers include AstraZeneca, Bang & Olufsen Medicom, the Swedish Postal Service and Commotion Printed Display Solutions. An optional pre-conference briefing session will take place on 26 January - an introduction to technologies and applications of intelligent packaging. Bring your concerns and share your experiences.




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