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Rhin-O-Tuff Announces New Range of Quietised Dies at Graph Expo 2012

Thursday, August 09, 2012

Press release from the issuing company

Rhin-O-Tuff has developed new die technology that reduces the noise level of punching holes in a document by over 25%! This new quietised die technology is a significant advancement for today's on-demand print and document bind world.

"With our new Quietised Die technology our new Rhin-O-Tuff Onyx series of punches can be positioned in any office environment instead of being restricted to a back room to conceal the loud noise emitted by many paper punches in today's market", said John Lugviel Vice President of Global Business Development for Rhin-O-Tuff.

With over 30,000 units installed worldwide and 98% of the equipment recyclable, Rhin-O-Tuff is justifiably proud of its acknowledged reputation for tough and durable products, made exclusively in Boise, Idaho, USA.

Full details of the extensive range of Rhin-O-Tuff binding products can be seen on www.rhin-o-tuff.com

Come see this new Quietised Die technology at Graph Expo 2012 Booth 2216.


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