Highcon Introduces Direct-To-Pack Revolution
Tuesday, November 29, 2011
Press release from the issuing company
Highcon is a young company with a clear focus and understanding of the folding carton packaging market, a defined vision, and an innovative product that will eliminate the need for conventional dies and herald the arrival of a new Direct-to-Pack market.
The company was founded in November 2009 by Aviv Ratzman and Michael Zimmer, both highly experienced professionals in the digital print market, working initially with Indigo N.V. and latterly HP.
The result of the extensive development effort is the Highcon Euclid. This revolutionary machine uses precision laser optics and polymer technologies to transform cutting and creasing from an analogue to a digital workflow, dramatically streamlining the finishing process.
‘Over the past two decades we have witnessed key areas of the supply chain becoming digital, but packaging finishing has remained analogue,” said Aviv Ratzman, Highcon’s CEO. “Converters and their customers have been unable to benefit from the speed and flexibility that digital solutions could provide to finishing. But this is about to change.”
A pedigree of innovation
Highcon is a private company with key investors including Landa Ventures, the investment company owned by the Indigo N.V. founder Benny Landa, and Israbieg, the largest die supplier in Israel and other print industry players.
Speaking of Highcon’s game-changing concept, Benny Landa said, "I believe that Highcon will do for the folding carton market what Indigo did for print - and the industry will be changed forever."
The Highcon digital converting solution dramatically increases speed to market, eliminates costly production steps and reduces the carbon footprint of packaging production. Moreover, the implementation of this new technology will drive numerous new packaging opportunities for converters, packaging printers and brand owners.
Chris Baker, Highcon VP Sales and Business Development, said: “We have been developing our product with input and advice from a number of top converters around the world to ensure we meet the market needs. We are confident that this technology will change the face of packaging finishing.”
The Highcon Euclid will be formally launched and demonstrated on our stand at drupa 2012, Hall 4 Stand B28, Düsseldorf, Germany.
To learn more about Highcon’s concept and product visit our new website www.highcon.net and register to be among the first to receive updates.
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