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Xennia introduces industrial inkjet printing solutions to US market at Pack Expo

Tuesday, October 26, 2010

Press release from the issuing company

Letchworth, UK - Xennia, the world's leading industrial inkjet solutions provider, will demonstrate its robust XenJet inkjet module range and versatile industrial inkjet solutions for packaging applications at Pack Expo, Chicago, USA on October 31st - November 3rd  2010.

Xennia's stand located in the Lakeside Lower hall, booth #8511 will showcase its XenJet print engine, fluid control and print software modules - the key elements of any reliable inkjet system - for use in applications such as flexible, box, carton and rigid package printing. The Xennia Sapphire inkjet printing system will demonstrate an example configuration of these modules using XenInx Diamond high performance UV cure ink to print onto a range of packaging substrates including examples of variable data printing (VDP).

Xennia's innovative product portfolio offers solutions for a vast array of industrial markets. Specifically for packaging applications, the Xennia Aquamarine printing system is targeted at high quality, multi-color batch printing of EPS fishboxes, chill boxes, cartons and other secondary packaging. The Aquamarine features high speed, single pass printing and full variable data capability with a 4.7" (120mm) print height and print speed of up to 1,800 boxes per hour. Xennia's new XenInx Onyx ink show excellent decorative properties and allows digital printing of metallic effects onto packaging.

"Pack Expo is a key show and ideal for showcasing Xennia's proven XenJet inkjet module technology for packaging applications," said Dr Alan Hudd, Xennia's Managing Director. "Xennia's industrial inkjet solutions are flexible and economical for short runs, requiring minimal set up time and cost compared with conventional printing. This allows packaging printers to reduce their inventory and respond quickly to market demands with 'just-in-time customization'. Xennia's attendance at Pack Expo will provide the opportunity for OEMs to experience these benefits of digital technology, and understand how to integrate them into their existing systems."

Xennia's products will be showcased at Pack Expo 2010, booth #8511 in the Lakeside Lower hall.




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