Full house for OMET-ESKO seminar at Clemson's Sonoco Packaging Institute!
Tuesday, November 10, 2009
Press release from the issuing company
Clemson, SC - Judging by the the number of attendees and their comments, The Future of Flexo seminar presented by OMET & ESKO at the Sonoco Packaging Institute at Clemson University was a huge success! A capacity crowd of 60 participants jammed into the Packaging Institute to hear about the latest technologies from an assortment of suppliers, learn about expanded gamut printing from the two featured speakers as well as view hi-def & expanded gamut printing running on the OMET Varyflex press.
Attendees heard from and had hands-on demos from the following sponsors and their new technologies;
-ESKO – New! Equinox expanded gamut & Hi-Def software
-Harper – New! QD proofing system
-Environmental Inks – New! Fastmatch color management system
-Flint Group – New! Ultra thin plates
-Anderson-Vreeland – New! Plate measurement devices
-OMET – Varyflex press with low waste, quick change features running 3 different jobs on 2 different substrates!
Featured speakers included;
*Mark Samworth of ESKO presenting on the advantages of expanded gamut for packaging, that it has reached a tipping point in the marketplace and ESKO's new Equinox system.
*John Fulcoly of Packaging CPR spoke about commercial considerations of expanded gamut printing for packaging based on his 25 years of experience implementing a large North American expanded gamut platform.
Attendees comments included;
"A great seminar, very useful information",
'Great use of my time, I was able to learn about the latest technologies, speak to multiple vendors AND see demonstrations of everything that was presented, all in one trip",
"Esko's Hi-Def software allows flexo to match offset print quality",
Amazing press, perfect technology for today's short run business",
"The Packaging Institute is a spectacular resource, nothing like it anywhere else!".
OMET & ESKO will repeat this seminar in the spring of 2010 as well as present seminars/workshops on other pertinent packaging topics next year at the Sonoco Packaging Institute. If you are interested in learning more about this or upcoming seminars please contact; firstname.lastname@example.org, 860-232-2323 x132.
For more information about:
- OMET contact Steve Leibin at Matik Inc., call 860-232-2323 x132 or visit www.matik.com
- ESKO contact Eric Ferguson, call 770-289-5085 or email: email@example.com